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[September 2004]
Materials, Integration and Packaging for HF Devices
The MRS - Materials Research Society (Warrendale, PA, USA) has announced the publication of 'Materials, Integration and Packaging Issues for High-Frequency Devices', Volume 783 from the MRS Symposium Proceedings Series and issuing from the 2003 Fall Meeting which was held in Boston, MA, USA.
This volume focuses on the materials technologies that are key to the advancement of high-frequency devices. The competition for better performing mobile phones is the main driving factor in this field. In mobile phones, passive components constitute 70% to 90% of the number of components, volume and costs.
The spirit of the volume is to bring together scientists in the processing, characterisation, packaging, device design and applications of passive devices to gain insight into the various paths along which technology of passive components is progressing.
Topics include: improvements in low-temperature co-fired ceramics (LTCCs); microstructure-property relationships in perovskites for new materials compositions, with lower firing temperatures, for microwave dielectrics with high quality factors; tunable ferroelectrics allowing low-cost solutions for frequency tuning and phase shifters; new integration platforms and resonators; and above-chip integration.
The book (hardback, code 783-PR) runs to 232 pages and costs US$105 (standard non-US), US$91 (US non-MRS member) or US$83 (MRS member). It is also available electronically on the MRS website with free access for all current MRS members.
www.mrs.org
ENDS