[October 2002]

Top 10 Developments in Ceramic Interconnect Technology Announced at IMAPS 2002

The latest advances and challenges - The Top Ten Developments in Interconnect Technology - were recognised at a recent press event hosted by the Ceramic Interconnect Initiative (CII) at IMAPS 2002, the 35th International Symposium on Microelectronics in Denver, CO, USA.

Nominations for the 'Top 10' were invited well in advance of the show and from those received the top ten were chosen. This was a global field including what was described as "some very fine work" that was evaluated by the CII Steering Committee - itself a globally recognised group of experts in ceramic interconnect technology.

The competition and the press round table were hosted by Mike Ehlert, a pioneer in the industry who has been particularly instrumental in the development of Low Temperature Co-fired Ceramics (LTCC). Mr Ehlert was elected chair of the CII in September 2001, replacing its founder Dr Samuel Horowitz. He has been active in the industry since 1968 with a broad range of experience in the electronic ceramic field with expertise in the fabrication of high alumina components, various classical ceramics, HTCC and LTCC and has been a major contributor to the development of the ceramic technology roadmap, which is said to have had a positive impact on the industry.

For their various developments, the Top 10 shaped up as follows:

1. Heraeus Inc
2. Cerel
3. CAD-Design Software
4. Midcom-ESL
5. Kyocera
6. NEC
7. Satcon
8. -
9. Three-way tie: Philips/National Semiconductor/Motorola
10. Plextek

IMAPS - the International Microelectronics & Packaging Society - is based in Washington, DC, USA.

http://www.imaps.org/

ENDS

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