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[May 2004]
IMAPS and ACerS to Co-Sponsor 2005 Ceramic Conference
IMAPS - the International Microelectronic & Packaging Society - and ACerS - the American Ceramic Society - have announced an agreement to jointly sponsor the International Conference on Ceramic Interconnect and Ceramic Microsystems Technology. This conference will be an expanded version of IMAPS' long-running and successful annual Ceramic Interconnect Conference.
IMAPS and ACerS technical leaders have teamed up successfully in the past two years, paving the way for this expanded commitment to grow the impact of ceramic interconnect and ceramic microsystems technologies by the two organisations.
In 2005, the conference will be held from 11-13 April in Baltimore, MD, USA at the Marriott Waterfront Hotel, in conjunction with the ACerS Annual Meeting. In 2006 and beyond, the conference will be held each spring as an independent event or in conjunction with another technical meeting.
ENDS