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[May 2001]
New Adhesive Suited to Low Expansion Components
CeramabondTM 618 is a new high temperature, silica-based ceramic adhesive developed by Aremco Products Inc (Valley Cottage, NY, USA).
The product is a single-part, phosphate bonded, silica filled ceramic compound which is claimed to provide exceptional adhesion to low expansion ceramics, quartz and glass as well as molybdenum and tungsten metals. This adhesive offers temperature resistance to 1000°C, a dielectric strength of 250V per mil and a volume resistivity of 109 ohm-cm at room temperature. It is said to offer excellent resistance to oxidation and most acids and alkalis.
Ceramabond 618 is an inorganic, water dispersible system which is easily dispensed by brush or syringe and which fully cures in one to two hours at 370°C. It also sinters and strengthens further as it is exposed to temperatures above 540°C. In the uncured state, it can be cleaned easily with warm water and soap.
Typical uses for the adhesive are in the assembly of quartz infrared heaters, and various instruments such as temperature probes, strain gauges, oxygen analysers, gas chromatographs and mass spectrometers. The product is available in 4oz jars and 5-gallon (US) buckets.
Web site: http://www.aremco.com
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