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[June 2007]
CoorsTek Introduces New Ceramic Substrates
CoorsTek (Grand Junction, CO, USA), the large technical ceramics manufacturer and long-time provider of electronic components, has introduced its new DuraStrate™ thick-film ceramic substrates. Developed specifically for improved performance in thick-film substrates, this new material is said to offer significant performance advantages over standard, widely available ceramic substrates.Specifically, CoorsTek is employing a finer grain (1.5 to 2.0 micron) microstructure material – chiefly responsible for a 20% increase in biaxial flexural strength over traditional materials, improved thick-film performance, consistent thicknesses, improved camber flatness and better aged adhesion.
The company said that this enhanced durability should translate to improved process yields, longer product life and superior reliability. CoorsTek currently offers the DuraStrate™ ceramic for only the very thin (10mm to
15mm) varieties of thick-film substrates."As the industry moves toward increased miniaturization, higher-power applications, and begins to demand longer-term reliability, they will need a more durable and reliable thick-film ceramic substrate," stated Lee Harder, Vice President of CoorsTek. "We developed and fine-tuned the DuraStrate material specifically for these needs and expect to make a significant impact in the industry."
www.coorstek.com
ENDS