[January 2002]

Ceramic Technique for Circuitry Packaging

A new development in the packaging of electronic circuitry, developed at Sarnoff Corporation, is said to bring significant advantages to demanding applications, including:

• low cost and ease of manufacture
• dimensional stability
• high power handling, low loss
• resistance to moisture and temperature
• the ability to accept embedded passive components

The technique is called LTCC-M, for Low-Temperature Co-Fired Ceramic-on-Metal. It can be used in either single or double-fired format.

Its applications range from power supplies to cell phones, from plasma displays and TV circuit boards to rugged high power modules for submarines.

ENDS

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