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[February 2006]
CoorsTek Introduces Ultra-Flat Ceramic Vacuum Wafer Chucks
CoorsTek Inc (Golden, CO, USA) has introduced ultra-flat, high purity ceramic vacuum chucks, said to offer significant performance advantages over traditional wafer chucks.
Specifically, CoorsTek ceramic vacuum chucks are three to five times stiffer than glass or metal alternatives which, coupled with advanced technical ceramic manufacturing, is claimed to drive chuck flatness to new standards. Available in several of the company's signature materials - including UltraSiC(tm) Silicon Carbide, PureSiC(r) CVD Silicon Carbide, PlasmaPure(tm) Alumina and StatSafe(tm) ESD Alumina - these chucks feature all the commonly known benefits of high purity ceramic including exceptional corrosion resistance, low thermal expansion and high thermal conductivity.
CoorsTek now offers several capabilities within the product range and produces an array of surface profiles designed to meet specific customer requirements. Chief among them is their ability to create specialised micro-bumps - especially useful when attempting to minimise backside surface contact area with the wafer.
"I think we're on the cusp of a significant technology shift away from glasses and metals in this particular application," noted Dr Frank Anderson, head of CoorsTek research and development.
www.coorstek.com/products/ceramic_chucks.asp
ENDS