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[February 2004]
Ceramic Interconnect Technology
Sandia National Laboratory, IMAPS, The Ceramic Interconnect Initiative and the American Ceramic Society have announced that the 2004 Conference on Ceramic Interconnect Technology will be held in Denver, CO, USA from 27-28 April 2004.
This technology has a long history of meeting the requirements of the most demanding applications. The growth of wireless communications to its current pervasive position in both developed and developing nations and extending from microwave to millimetre wave continues to create a host of opportunities for which ceramic technology is enabling.
At the same time, demand for bandwidth driven by the internet and data communications has sparked increased need for optical communication equipment and many new interconnect and packaging applications for performance at 40GB/sec and beyond. Ceramic is uniquely suited for these applications as well.
Automotive under the bonnet electronics for engine/transmission control, communications and safety applications continue to drive the growth of ceramic in automotive applications. In the MEMS, sensor and energy areas, innovative new applications - which rely on ceramic enabling technology - are moving from the laboratory to commercial status.
Conventional ceramic technologies such as thick film, thin film, plated copper and high temperature cofired ceramics are being revolutionised and extended by the development of low temperature cofired ceramics (LTCC), photo patterning and embedded passive component materials and processes that allow increased circuit density and functionality and improved performance. These advances are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensor and energy.
www.imaps.org
ENDS