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[December 2002]
Starfire Systems Receives Prestigious Advanced Technology Program Grant
Starfire Systems Inc (Malta, NY, USA) has been awarded a US$1.8 million National Institute of Standards & Technology (NIST) Advanced Technology Program Grant to develop 'Ceramic Matrix Composite Boards for SOP (System-On-a-Package) and SIP (System-In-a-Package) Electronic Packaging'. The total programme is expected to cost approximately US$4 million over three years.Under the programme, Starfire will develop a silicon carbide based ceramic matrix composite circuit board having the performance properties of monolithic ceramics and the processing advantages of polymer derived composites, which are expected to meet the increasingly demanding requirements of microminiaturised electronic systems for the next decade.
Starfire's proposed board technology will play a key role in next generation innovation of SOP technology, which it says will provide 10-fold improvements in size, cost, reliability and performance. SOP can deliver the advantages of system-level integration quicker and more affordably than System-On-a-Chip (SOC) technology. In addition, the new board material could also boost the US printed circuit board industry, which has been steadily losing ground to Pacific Rim competition.
ENDS