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[April 2005]
Dow Corning Launches New Lid-Seal Adhesive
Dow Corning Corp (Midland, MI, USA) has launched EA-6700 Microelectronic Adhesive, a new lid-seal material based on a unique chemistry that makes it ideally suited for the latest generations of flip-chip semiconductor packages. EA-6700 is the newest adhesive to emerge from Dow Corning's expanding family of packaging materials.
Adhesives for lid assembly, also referred to as cap assembly, are integral to the production of flip-chip devices, one of the fastest growing segments of the IC packaging market. In order to ensure device reliability, lid-seal adhesives face the challenge of withstanding high humidity, temperature cycling and extreme operating conditions.
EA-6700's unique chemistry improves the long-term reliability of flip-chip devices by offering excellent adhesion, thermal stability and moisture-resistance properties. The proprietary formula lowers outgassing and helps reduce voiding attributed to residual moisture within substrates, leading to improved adhesion to ceramic, organic and other substrates.
As with previous generations of Dow Corning adhesives, EA-6700 maintains a low modulus, a key quality that allows it to absorb stress when used between two materials (such as laminate substrates and nickel/copper lids) with differing thermal expansion coefficients.
www.dowcorning.com
ENDS