Semiconductor & Electronics
CERAM's experts have been solving problems for the semiconductor and electronics industries for over 30 years. We have worked with major international companies on wafer, device, component and PCB issues. This has given us a clear insight into processes and their associated problems, from design and development through to manufacture and in-field performance.
Our surface and micro-analytical techniques are critical for:
- Assessing starting material quality
- Qualifying production tools
- Monitoring dopant levels
- Solving yield issues
- Failure analysis
- Cleanroom contamination problems
- Wafer contamination problems
- PCB defects and field failures
- Adhesion, soldering and disbondment issues.
Application Examples
- Assessing the cleanliness of semiconductor wafers after treatment
- Quantifying B, P and As dopant dose
- Measuring junction depths and profile shape
- Locating and identifying interfacial contaminants in layer structures
- Identifying organic contamination on silicon wafers
- Identifying particle contamination on wafers, devices and PCBs
- Measuring surface roughness and topography on device structures
- Investigating corrosion problems on IC contacts
- Investigating solder mask contamination
- Characterising layer structure and dopant concentrations in photovoltaics.
CERAM Examines Layer Growth and Doping Uniformity in Solar Photovoltaics
SIMS depth profiling
CERAM Investigates Electrical Drift in MOSFET Devices
SIMS analysis provided by CERAM
CERAM Reveals the Cause of Corrosion during the Manufacture of Semiconductor Devices
Expert analysis provided by CERAM